cpu chip造句
例句與造句
- Development of cpu chip package technology
芯片封裝技術(shù)的發(fā)展演變 - The development of cpu chip package technology
芯片封裝技術(shù)的發(fā)展 - Registers on a given cpu chip that store very low - level information
給定cpu芯片上存儲(chǔ)非常低級(jí)別信息的寄存器。 - This paper presents the logic circuit design of ccu for lx - 1164 cpu chip , for ccu , data and instructions are stored in separate data and instruction caches
本人有幸在夏宏博士的指導(dǎo)下參加這一工程，承擔(dān)lx ? 1164cpu的高速緩存控制器( ccu )的邏輯設(shè)計(jì)和功能仿真。 - I guess the most notable thing is putting the memory controller on the cpu chip , which has already been done by the alpha people , and has already been shown to have upsides and downsides
我想最值得注意的就是將存儲(chǔ)器控制器放到cpu芯片上，這一點(diǎn)開(kāi)發(fā)alpha的人員已經(jīng)使用了，而且已經(jīng)表現(xiàn)出有利也有弊。 - It's difficult to find cpu chip in a sentence. 用cpu chip造句挺難的
- The higher the processing speed of computer , the more heat generating from cpu chip . if the heat ca n ' t be dissipatied effectively , the processing stability and speed will be decreased dramatically
計(jì)算機(jī)運(yùn)行速度越高其芯片cpu發(fā)熱量越大，如果這些熱量得不到有效散逸，會(huì)制約芯片速度的進(jìn)一步提高。 - In order to fit the demand for future high speed cpu chip whose running heat flux reaches to 100 - 1000w / cm2 , the development of an efficient cooling technology has become the update key projects all over the world
針對(duì)熱流密度高達(dá)100 ? 1000w / cm2的高速cpu芯片，開(kāi)發(fā)有效的冷卻技術(shù)，是當(dāng)今世界正在研究的重要課題。 - Dsp products used primarily multi - cpu chips and parallel processing technology , to develop a series of products has been widely used for electricity , communications , transportation , national defense and generating new energy fields
主要產(chǎn)品采用dsp芯片及多cpu并行處理技術(shù)，開(kāi)發(fā)出的系列產(chǎn)品已廣泛應(yīng)用于電力、通信、交通、國(guó)防及新能源發(fā)電等領(lǐng)域。 - But when the wind - speed becomes above 1m / s hereafter , wind - speed increase for the cpu thermal siphon of transmit heat the ability ' s gain result the deceleration . so it is considered perfect when the wind - speed is 1m / s . through this experimentation we found that when the cpu thermal syphon cooling machine used acetone as working fluid , wind - speed 1m / s , cpu chip caloricty 60w , its volumetric heat release rate came to 1 . 3 104w / ( m3k )
通過(guò)本次實(shí)驗(yàn)測(cè)出所使用的cpu重力熱管散熱器在使用丙酮為工質(zhì)，風(fēng)速1m / s ， cpu芯片發(fā)熱量為60w時(shí)，其體積散熱率達(dá)到1 . 3 104w / ( m3k ) ,能保證芯片溫度與環(huán)境溫度之差小于40 ，能很好的適應(yīng)pentium -計(jì)算機(jī)長(zhǎng)期運(yùn)行的要求。